MPi Grey Owl Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is commonly utilized on gold bump and pad wafer testing for Screen driver, logic, and memory device. MPI’s cantilever probes would be the corresponding answer into the needs of fi­ne pitch, compact pad measurement, higher speed, significantly less cleansing, multi-DUT, superior pin depend, and extremely-small leakage requirements. With exceptional craftsmanship, innovative architecture and confirmed methodologies based upon mechanical and electrical simulation/measurement benefits, earning MPI the top cantilever supplier around the globe.


FCB Probe Card

The FCB Probe Card is considered the most experienced technologies of buckling beam probe card. It is aimed to realize the semiconductor ship manufacture time-to-market (TTM) and value of exam (COT) desire. FCB is usually a verified Answer for a range of semiconductor production assessments from early engineering pilot-operates to substantial volume production (HVM). FCB is prepared for unit demanding high signal integrity probing (SI) and/or energy integrity probing (PI). Applications contain reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB assures the whole world’s very best General Price-of-possession (COO) for various DUT applications.


EVS Probe Card

The EVS Probe Card can be an enhancement more than the traditional EVS Probe Card buckling beam probe card. Important attributes are higher latest carrying ability (C.C.C.) and decreased well balanced Make contact with drive (BCF), and also General MEMS-like features. EVS can easily meet up with the requirement of Innovative wafer probing. Specific alignment and exceptional planarity Handle will be the crucial things contributing to secure Call resistance. With its potential and general performance, EVS Probe Card is an excellent choice for advanced probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Option to need for at any time finer pitch. It really is created for smaller sized Al pad, and is particularly ideal for tiny pitch application with peripheral and comprehensive array pattern. With precise alignment and greater planarity Handle, Osprey can reach larger efficiency by multi-DUT style and design.  The forming wire (FW) type needle generated with MPI’s personal micro fabrication process don't just delivers large-excellent efficiency but in addition lets quick needle substitution and shortens maintaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of reduced force probing. Additionally, it comes with the ability to fulfill superior C.C.C. and superior pin counts software. The MEMS course of action makes certain hugely regular needle attributes, along with the Particular structure design permits specific alignment and planarity Management.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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